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Epoxy sealant is a high-strength, superior electrical performance, and high surface gloss adhesive formed by mixing epoxy resin and curing agent. This sealing adhesive can cure at room temperature and has characteristics such as high transparency, high adhesion, waterproofing, high temperature resistance, and corrosion resistance. Widely used in electronic and electrical equipment, it has strong structural support and mechanical protection capabilities after curing. Due to its relatively low price, it is widely used in the automotive industry, consumer electronics components, wind power equipment, aerospace and other fields to enhance the mechanical structural stability and performance stability of these components in harsh environments.
Product Introduction: JOME 3113-1A/B is a two-component solventless, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance.
| Status | Item | Method | Unit | JOME 3113-1 A | JOME 3113-1 B |
|---|---|---|---|---|---|
| Before Cured | Appearance | Visual | --- | Black Liquid | Beige Paste |
| Viscosity | GB/T 10247 | mPa·s | 20,000±3,000 | 25 | |
| Density | GB/T 13354 | g/cm³ | 2.35±0.05 | 0.93±0.05 | |
| Mix Rate | Mass Ratio | A:B | 100 : 8 | ||
| After Cured | Hardness | GB/T 531.1 | Shore D | 90 | |
| Thermal Conductivity | GB/T 10297 | W/mK | 1.2±0.1 | ||
| Glass Transition Temp | DSC | ℃ | 95 | ||
| Dielectric Strength | GB/T 1693 | kV/mm | ≥18 | ||
| Item No | Application | Performance Characteristics |
|---|---|---|
| 3102 General | General electronic components and circuit boards. | Bright surface, no cracking, moisture insulation. |
| 3105 Thermal | High-power electronic modules with heat requirements. | High heat dissipation properties. |
| 3108 Transparent | Transparent potting for lighting and modules. | High transparency, room temperature curing. |
| 3115 Heat-resistant | General heat-resistant component potting. | Full curing at 80ºC, usable up to 180ºC. |
